BCZenn All Black

All Black Back-Contact Solar Panels for Residential Rooftops

Half-cut back-contact cell with glowing circuit traces

96 Half-Cut Back-Contact Cells

Impact resistance: 35 mm

Impact Resistance

Temperature coefficient: -0.26 %/°C

Temperature Coefficient

All-black solar module seen at an angle

All Black

Edge of a framed glass-glass solar module

2.0 mm Framed Glass-Glass Construction

Solar module surface under falling snow and water droplets

6000 Pa Snow Load 4000 Pa Wind Load

Market-Leading Efficiency

Back-contact design eliminates front gridline shading unlocking market-leading efficiency and maximum power density

BC-Z48G All Black

480W Max. Module Power

24.0% Max. Module Efficiency

Superior Aesthetics

All-black, grid-free front surfaces create a sleek premium aesthetic for residential roofs and BIPV projects

BC module cell with an all-black, grid-free front surface
versus
Traditional solar cell with visible front gridlines

Grid-free front surface

Traditional module with visible gridlines

Advanced Hot Spot Protection

BC architecture enables cell level bypass under shade, suppressing hot spot formation to maximize safety and power output

BCZenn module under single-cell shading: only the shaded cell is bypassed
versus
Regular module under single-cell shading: a whole cell string loses output

BCZenn

Single-cell shading activates localized current bypass, confining power loss strictly to the shaded area

Regular Module

Single-cell shading risks hot spot formation or full-string bypass activation, decreasing power output across entire cell strings

Optimized Temperature Coefficient

A low temperature coefficient minimizes heat-induced power drop keeping energy production high when roof temperatures peak

-0.26% / °C Pmax temperature coefficient
Power Performance vs Temperature chart: output power from 25 °C to 80 °C, BCZenn -0.26%/°C vs TOPCon -0.29%/°C; BCZenn stays ahead by +1.1% at 60 °C, +1.4% at 70 °C and +1.7% at 80 °C (85.7% vs 84.0%)

Microcrack Risk Mitigation

Rear-side interconnects reduce solder joint stress to mitigate micro-cracks and boost long-term durability

TOPCon cell: S-shaped front ribbons stressing the cell edge
versus
BCZenn cell: rear-side interconnects, no ribbon across the cell edge

TOPCon

BCZenn